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SYMPOSIUM TOPICS
The Symposium aims at providing a productive and informal environment for a fruitful exchange of ideas. Papers are solicited mainly, but not only, in the following areas:
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Qualification and evaluation results:
o Ageing
o Storage
o Humidity
o Thermal cycling
o Radiation
o Shock/Vibration
- Quality and Reliability Techniques for devices and systems:
o Reliability simulation
o Virtual qualification
o Reliability indicators
o Early detection
o Screening methods
o Reliability test structures
o Limits to accelerated tests
o Yield/reliability relationship
- Packaging and Assembly reliability:
o Failure mechanisms and environmental constraints
o Package design and optimization
o Bonding, solders and joints
o Connectors
- Failure analysis:
o Electron, ion and optical techniques
o Scanning probe techniques
o Acoustic microscopy
o Electrical and thermal characterization
o Sample preparation, construction analysis
o Failure analysis: case studies
- Physical modelling and simulation for reliability prediction:
o Characterization of defects
o Defect models
o Numerical simulation
- Test facilities:
o Qualification and evaluation tests
o Failure analysis
The technical program will include oral (15 min talks questions included) and poster sessions. Tutorial short courses will be offered in conjunction with the symposium. Tutorial lectures will be given by experts on several fields of Optoelectronics and Reliability.
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