|
SYMPOSIUM TOPICS
The Symposium aims at providing a productive and informal environment for a fruitful exchange of ideas. It features a technical program consisting of several sessions dedicated to :
-
Imagers : APSs, CCDs, bolometers, IR detectors, UV detectors
- Emitters : laser diodes, light emitting diodes
- Photoreceivers : photodiodes, phototransistors, solar cells
- Optical functions :
o Guiding : optical fibres, waveguides
o Amplification : semiconductor amplifiers, rare-earth doped fibre amplifier
o Modulation : electro-optic modulators, acousto-optic modulators, Pockels cell
o Routing : couplers, multiplexers
o Isolation : isolators
o Switching : optical switches (including MOEMS-based solutions)
o Interfacing : optocouplers
At the end of the Symposium, the thematic day, OPTORAD (OPTOelectronic devices - RADiation effects), sponsored by the RADECS association, will target tutorials on the effects of space radiations on optoelectronic devices. It will also be a chance for designers, manufacturers and end-users to share their experience and feed-backs with respect to test conditions and hardening solutions.
The technical program includes oral (20 min talks questions included) and poster sessions. Tutorial short courses will be offered in conjunction with the symposium. Tutorial lectures will be given by experts on several fields of optoelectronics.
The organising committee invites authors to submit both paper and poster contributions in the following areas :
| ISROS |
-
Qualification and evaluation results
o Ageing
o Storage
o Humidity
o Thermal cycling
o Radiation
o Shock/Vibration
-
Quality and Reliability Techniques for devices and systems
o Reliability simulation
o Virtual qualification
o Reliability indicators
o Early detection
o Screening methods
o Reliability test structures
o Limits to accelerated tests
o Yield/reliability relationship
-
Packaging and Assembly reliability
o Failure mechanisms and environmental constraints
o Package design and optimization
o Bonding, solders and joints
o Connectors
-
Failure analysis
o Electron, ion and optical techniques
o Scanning probe techniques
o Acoustic microscopy
o Electrical and thermal characterization
o Sample preparation, construction analysis
o Failure analysis: case studies
-
Physical modelling and simulation for reliability prediction
o Characterization of defects
o Defect models
o Numerical simulation
-
Test facilities
o Qualification and evaluation tests
o Failure analysis
|
|